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In telecommunication, a wafer is a thin slice of semiconducting material, such as a silicon crystal, upon which microcircuits are constructed by diffusion and deposition of various materials.

Note: Millions of individual circuit elements, constituting hundreds of microcircuits, may be constructed on a single wafer. The individual microcircuits are separated by scoring and breaking the wafer into individual chips ("dice").

Source: from Federal Standard 1037C

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